路浩天,卢晓青,蔡良续.塑封电子元器件温度失效机理研究[J].装备环境工程,2012,9(6):36-39,43. LU Hao-tian,LU Xiao-qing,CAI Liang-xu.Study on Temperature Effect of Plastic Encapsulated Microcircuit[J].Equipment Environmental Engineering,2012,9(6):36-39,43.
塑封电子元器件温度失效机理研究
Study on Temperature Effect of Plastic Encapsulated Microcircuit
Failure analysis of plastic encapsulated microcircuit in temperature recycle test was carried out by using non-destructive technique and destructive microscopy analysis technique. The development of defects was studied. Suggestions were put forward on improvement of device design and existing standards.