| 王开山,李传日,郭恒晖,庞月婵,李鹏.基于相关性分析的 PCBA 热力 学模型修正[J].装备环境工程,2014,11(5):119-124. WANG Kai-shan,LI Chuan-ri,GUO Heng-hui,PANG Yue-chan,LI Peng.Study on the Method of Thermodynamics Model Updating of Printed Circuit Board Assembly[J].Equipment Environmental Engineering,2014,11(5):119-124. |
| 基于相关性分析的 PCBA 热力 学模型修正 |
| Study on the Method of Thermodynamics Model Updating of Printed Circuit Board Assembly |
| 投稿时间：2014-07-14 修订日期：2014-08-19 |
| DOI：10. 7643 /issn. 1672-9242. 2014. 05. 023 |
| 中文关键词: 拉丁超立方抽样 Speraman 等级相关系数 参数筛选 热模型修正 |
| 英文关键词:Latin hypercube sampling Speraman rank correlation coefficient parameter screening thermodynamics model updating |
| 基金项目: |
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| Author | Institution |
| WANG Kai-shan | Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing 100191, China |
| LI Chuan-ri | Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing 100191, China |
| GUO Heng-hui | Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing 100191, China |
| PANG Yue-chan | Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing 100191, China |
| LI Peng | Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing 100191, China |
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| 中文摘要: |
| 目 的 精确且高效地对印制电路板组件热力学模型进行修正。 方法 采用 基于拉丁超立方抽样试验设计和 Speraman 等级相关系数计算公式的相关性分析方法, 找出 电子产品热仿真试验中对元器件表面温度值影响较大的 输入参数, 然后进一步分析得出 输入与 输出 之间 的 函数关系。在此基础上给出 印制电路板组件( PCBA) 热力学模型修正的一般方法流程。 最后利 用 该方法对某航空电子产品中一块 PCBA 的热力学模型进行修正。 结果 修正结果较精确且只调用 2 次有限元软件。 结论 该热模型修正方法具有较高的精确性和高效性, 可推广用 于工程实践。 |
| 英文摘要: |
| Objective To update the thermodynamics model of the printed circuit board assembly accurately and efficiently. Methods The input parameters with great effects on the surface temperature of a component in the thermal simulation test were found out through the correlation analysis method which was based on the Latin hypercube sampling experiment design and the computational formula of Speraman rank correlation coefficient. And then the function relationship between the input and output was obtained after further analysis. On this basis, the general process of the thermodynamics model updating of the printed circuit board assembly was provided. Finally, the thermodynamics model of a PCBA from an aircraft electronic product was updated with this method. Results The result of the updated model showed good accuracy and only two calls to finite element software. Conclusion This method of thermodynamics model updating had good accuracy and efficiency, and could be used in engineering practice. |
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