| 许磊.产品电子元器件封装及加固技术[J].装备环境工程,2016,13(4):157-161. XU Lei.Encapsulation and Reinforcement Technology of Electronic Devices[J].Equipment Environmental Engineering,2016,13(4):157-161. |
| 产品电子元器件封装及加固技术 |
| Encapsulation and Reinforcement Technology of Electronic Devices |
| 投稿时间：2016-03-18 修订日期：2016-08-15 |
| DOI：10.7643/ issn.1672-9242.2016.04.025 |
| 中文关键词: 电子器件 材料 三防技术 封装技术 加固技术 |
| 英文关键词:electronic device materials three-defense technology encapsulating technology reinforcement technology |
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| 中文摘要: |
| 为保证电子器件的环境适应性和可靠性要求，在传统“三防”的基础上，着重论述了产品电子元器件的封装、加固技术。方法 介绍了常用的封装加固材料的性能，针对不同的器件，规定了封装加固工艺流程，其中针对导引头提出了两种封装材料，其耐冲击指标达到8×103g～20×103g。为三防设计及选材提供了依据，对工艺防护提供了实际经验和技术要求，从而避免缺陷导致的质量问题。电子元器件封装加固技术，能够提高电子产品的防护性能，具有一定指导作用。 |
| 英文摘要: |
| To meet the requirements on environmental adaptability and reliability of electronic devices, this work focuses on the encapsulation and reinforcement technology of electronic devices on the basis of the traditional "three-defense". It introduced the performance of commonly used encapsulating and reinforcement materials and specified the encapsulation and reinforcement process for specific devices. Two encapsulating materials with impact resistance at 8×103g～20×103g were put forward for seeker. It provided a basis for "three-defense" design and material selection and offered practical experience and technical requirements for process protection so as to avoid quality problem that was caused by fault. Encapsulation and reinforcement technology of electronic devices can improve the protective performance of electronic products and has a certain guiding role. |
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