| 吕基成,许斌,钱建才,邹洪庆.基于SEM图像处理法的化学镀Ni-P合金表面改性基底层孔隙表征[J].装备环境工程,2017,14(5):82-85. LYU Ji-cheng,XU Bin,QIAN Jian-cai,ZOU Hong-qing.Characterization of Microporous on Modified Base of Ni-P Alloy Based on SEM Processing Technique[J].Equipment Environmental Engineering,2017,14(5):82-85. |
| 基于SEM图像处理法的化学镀Ni-P合金表面改性基底层孔隙表征 |
| Characterization of Microporous on Modified Base of Ni-P Alloy Based on SEM Processing Technique |
| 投稿时间：2016-12-30 修订日期：2017-05-15 |
| DOI：10.7643/ issn.1672-9242.2017.04.018 |
| 中文关键词: 电化学蚀刻 孔隙表征 孔隙率 Ni-P合金 |
| 英文关键词:electrochemical etching microporous characterization porosity Ni-P Alloy |
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| 中文摘要: |
| 目的 对Ni-P合金表面层孔隙进行定量表征。方法 通过SEM微观形貌图像分析孔隙分布，运用ImageJ软件对SEM图像进行处理，并统计分析Ni-P合金表面层孔隙的孔隙率、孔隙数目、等效直径等数据。结果 电化学蚀刻在改性Ni-P合金表面层制备微孔层，随时间延长，表面微孔数量增多、孔径增大。蚀刻1，3，5 min的孔隙率分别为0.85%，4.34%，11.18%，蚀刻5 min后微孔发生交联，Ni-P合金层防护性能被破坏。结论 电化学蚀刻3 min可在Ni-P合金表面层获得分布均匀、等效直径主要分布在100~850 nm之间的微孔。 |
| 英文摘要: |
| Objective to study the quantitative characterization of surface layer pores of Ni-P alloy. Methods Microporous distribution was analyzed by observing SEM microstructure image. The software Image was adopted to treat SEM image and analyze porosity, number of pores, equivalent diameter, etc. on Ni-P alloy surface. Results A microporous layer was prepared on the modified NI-P surface by electrochemical etching. The amount of microporous and the aperture of pores were increased with time. The porosity of microporous after etching for 1min, 3min and 5min was 0.85%, 4.34% and 11.18%. The protection performance of Ni-P alloy was destroyed after etching 5min for. Conclusion After etching for 3min, the microporous of Ni-P layer with the equivalent diameter are distributed uniformly in the range of 100~850 nm. |
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