| 李永正,李昕昕,党炜,孙卓午,张泽明.温度循环下塑封器件可靠性评估分析[J].装备环境工程,2018,15(8):83-87. LI Yong-zheng,LI Xin-xin,DANG Wei,SUN Zhuo-wu,ZHANG Ze-ming.Reliability Evaluation and Analysis of Plastic Encapsulated Device Based on Temperature Cycle[J].Equipment Environmental Engineering,2018,15(8):83-87. |
| 温度循环下塑封器件可靠性评估分析 |
| Reliability Evaluation and Analysis of Plastic Encapsulated Device Based on Temperature Cycle |
| 投稿时间：2018-05-03 修订日期：2018-08-25 |
| DOI：10.7643/ issn.1672-9242.2018.08.016 |
| 中文关键词: 塑封器件 温度循环 评估 可靠性 |
| 英文关键词:plastic encapsulated device temperature cycle evaluation reliability |
| 基金项目:中国科学院青年创新促进专项基金（CASYI2014135） |
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| Author | Institution |
| LI Yong-zheng | Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China |
| LI Xin-xin | Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China |
| DANG Wei | Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China |
| SUN Zhuo-wu | Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China |
| ZHANG Ze-ming | Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China |
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| 中文摘要: |
| 目的 评估塑封器件的热疲劳寿命和可靠性。方法 分析NASA和ECSS空间任务用低等级器件评估标准，针对某型号任务用的两种塑封器件制定了温度循环评估方案。在55～+125 ℃进行500次温度循环，配合外观检查、X射线检查、声学扫描显微镜检查、常温测试检测项目。结果 SOP-8（Small Out-line Package）器件评估合格，各项检测试验项目合格，其可靠性寿命满足某型号任务单机载荷2年需求。SOT-23（Small Out-line Transistor Package）器件出现功能失效，分层扩展至整个焊板区域，内部键合丝断裂，电参数失效比例为95%。结论 塑封器件评估需要制定有针对性的评估方案，经评估验证，部分塑封器件的可靠性可满足高可靠领域任务需求，兼备高可靠性与高性能。 |
| 英文摘要: |
| Objective To assess thermal fatigue life and reliability of plastic encapsulated devices. Methods Low-level device evaluation standards of NASA and ECSS were analyzed and a temperature cycling evaluation scheme was developed for two types of plastic encapsulated devices used for a certain type of task. 500 cycles were carried out at 55~+125 ℃ with the external visual inspection, X-ray examination, scanning acoustic microscopy examination and electrical test. Results The SOP-8 (Small Out-line Package) device was qualified, and the test items were qualified, and its reliability life could meet the requirements single machine of a certain type of task for 2 years. The functions of SOT-23 (Small Out-line Transfer Package) were invalid, and the delamination was extended to the whole welding plate area. The internal bonding wire was broken and the failure rate of electrical parameters was 95%. Conclusion Evaluation of plastic encapsulated devices needs to develop a targeted evaluation plan. After evaluation and verification, and the reliability of some plastic encapsulated devices can meet the mission requirements of high reliability field through evaluation, with high reliability and high performance. |
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