| 李庆,韦锡峰,俞佳江.卫星综合电子系统环境试验方法研究[J].装备环境工程,2019,16(3):95-100. LI Qing,WEI Xi-feng,YU Jia-jiang.Environment Test Method for Satellite Integrated Electronic System[J].Equipment Environmental Engineering,2019,16(3):95-100. |
| 卫星综合电子系统环境试验方法研究 |
| Environment Test Method for Satellite Integrated Electronic System |
| 投稿时间：2018-09-06 修订日期：2019-03-25 |
| DOI：10.7643/ issn.1672-9242.2019.03.020 |
| 中文关键词: 卫星 综合电子 环境试验 条件设计 |
| 英文关键词:satellite integrated electronic environmental test specification determination |
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| 中文摘要: |
| 目的 为适应卫星综合电子系统“货架产品化”的发展趋势，将传统的以单机级为主体的环境试验分解到功能模块级。方法 分别建立综合电子单机和模块有限元模型，开展动力学、热力学等仿真分析，以模块上关键部位能否达到单机试验时的考核量级为判据，获得模块级试验时的输入条件。结果 以随机振动试验为例，通过有限元分析，某综合电子单机若要达到鉴定级试验（单机输入量级为14.33g）考核，则功能模块上的力学输入分别为x向18.06g、y向15.07g、z向15.54g。以此为基础，在ACT2000振动台上开展了环境模拟试验验证，采集了模块上的最大响应。经分析，力学响应最大误差为6.31%，满足工程误差小于10%的要求。结论 基于综合电子功能模块的环境试验，可以覆盖单机试验时的考核要求，有利于尽早发现产品缺陷，降低研制成本。 |
| 英文摘要: |
| Objective To adapt to the “productization” development trend of satellite integrated electronic system and divide the traditional instrument-oriented environment test to functional modules. Methods Finite element models on integrated electronic instrument and module were established to have simulation analyses on dynamics, thermodynamics, etc. Input conditions in module test were obtained based on if the key components of function module could achieve the setting standard for instrument-oriented test Results With random vibration test as example, the FEM analysis showed that the mechanical settings of each direction should be x 18.06 g\y 15.07 g\z 15.54 g, to meet the equal setting qualification standard as 14.33 g for the instrument-oriented test. Maximal responsibility from function module was collected while carrying out the environment test on ACT2000 vibration machine. The maximal mechanical responsibility error was 6.31%, which met the demand for engineering error analysis (less than 10%). Conclusion Environmental test based on integrated electronic function module can meet the setting standard for instrument-oriented test. It is easier to find out design defect in an early phase, so to reduce research and development cost. |
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