| 李哲,蒙莉,许广宁,袁光华.高加速寿命试验在光纤声光调制器上的应用研究[J].装备环境工程,2020,17(3):78-83. LI Zhe,MENG Li,XU Guang-ning,YUAN Guang-hua.Highly Accelerated Life Test Applied to Optical Fiber Acousto-optic Modulator[J].Equipment Environmental Engineering,2020,17(3):78-83. |
| 高加速寿命试验在光纤声光调制器上的应用研究 |
| Highly Accelerated Life Test Applied to Optical Fiber Acousto-optic Modulator |
| 投稿时间：2019-08-31 修订日期：2019-09-25 |
| DOI：10.7643/issn.1672-9242.2020.03.013 |
| 中文关键词: 高加速寿命试验 失效模式 可靠性 |
| 英文关键词:highly accelerated life test failure mode reliability |
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| 中文摘要: |
| 目的 将光纤声光调制器产品缺陷激发为可被检测到的故障，找出失效模式，为建立失效机理库及提升产品可靠性提供依据。方法 采用高加速寿命试验的方法，结合敏感应力分析结果，设计试验方案，并进行试验，快速将产品内部的设计和工艺缺陷激发出来，变成可检测到的故障。对故障产品进行失效分析，找出失效模式。结果 本试验激发出5类故障，对故障进行隔离，选5类故障对应的故障产品进行失效分析。6#被试品未见异常，8#、12#、15#为内部电-声换能器机械开裂导致失效，11#为晶振内部引脚在振动过程中受到应力作用断裂，导致晶振无输出。结论 统计出两类失效模式，一类为电-声换能器机械开裂、一类为晶振内部引脚在振动过程中受到应力作用断裂，为产品后期进一步分析失效机理、建立失效机理库并结合失效机理进行相应的可靠性提升及工艺优化提供了依据。 |
| 英文摘要: |
| The paper aims to stimulate the product defect of the fiber-optic and acousto-optic modulator into a fault that can be detected to find the failure mode, to provide a basis for establishing the failure mechanism library and improving the reliability of the product. The method of high accelerated life test was adopted in combination with the analysis results of sensitive stress, to design the testing program, conduct the test, quickly excite the design and industrial defects inside the product, to turn it to a detectable fault, so as to perform failure analysis on the failing product, and finally find the failure mode. The test provoked five faults, then isolated the faults, and selected five failing products for failure analysis:the tested object 6# showed no abnormality, 8#, 12#, 15# were invalid resulted from the mechanical cracking of the internal electro-acoustic transducer. 11#:the internal pin of the crystal oscillator was subjected to stress during the vibration process, resulting in no output of the crystal oscillator. Two types of failure modes are counted, one is the mechanical cracking of electro-acoustic transducers, and the other is the cracking of the internal pins of the crystal oscillator caused by stress during the vibration process. It provides a basis for further analyzing the failure mechanism, establishing the failure mechanism library and performing corresponding reliability improvement and process optimization in combination with the failure mechanism. |
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