| 战贵盼,谭晓明,彭志刚,张丹峰,王德.实验室模拟海洋环境下印制电路板腐蚀损伤行为[J].装备环境工程,2021,18(12):65-72. ZHAN Gui-pan,TAN Xiao-ming,PENG Zhi-gang,ZHANG Dan-feng,WANG De.Corrosion Damage Behavior of Printed Circuit Board in Simulated Marine Environment[J].Equipment Environmental Engineering,2021,18(12):65-72. |
| 实验室模拟海洋环境下印制电路板腐蚀损伤行为 |
| Corrosion Damage Behavior of Printed Circuit Board in Simulated Marine Environment |
| 投稿时间：2021-04-16 修订日期：2021-06-15 |
| DOI：10.7643/issn.1672-9242.2021.12.011 |
| 中文关键词: 印制电路板；加速腐蚀试验；导通电阻；绝缘电阻；腐蚀损伤规律中图分类号:V216.5 V243 TG174 文献标识码:A 文章编号:1672-9242(2021)12-0065-08 |
| 英文关键词:printed circuit board accelerated corrosion test on resistance insulation resistance corrosion damage law |
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| Author | Institution |
| ZHAN Gui-pan | Naval Aviation University Qingdao, Qingdao 266041, China |
| TAN Xiao-ming | Naval Aviation University Qingdao, Qingdao 266041, China |
| PENG Zhi-gang | Naval Aviation University Qingdao, Qingdao 266041, China |
| ZHANG Dan-feng | Naval Aviation University Qingdao, Qingdao 266041, China |
| WANG De | Naval Aviation University Qingdao, Qingdao 266041, China |
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| 中文摘要: |
| 目的 研究实验室模拟海洋环境下，机载设备舱内印制电路板的腐蚀损伤行为和规律。方法 基于实测的某型机机载设备舱海洋环境数据，编制加速腐蚀试验环境谱，针对化学镀镍金印制电路板开展加速腐蚀试验；以宏微观腐蚀形貌、导通电阻以及绝缘电阻等为腐蚀表征行为参数，分析实验室模拟海洋环境下印制电路板腐蚀损伤演变的一般规律。结果 实验室模拟海洋环境下，印制电路板腐蚀首先从元器件引脚、通孔等区域诱发，腐蚀现象严重，严重影响导通电阻和绝缘电阻等电气性能的稳定性。加速腐蚀历程中，印制电路板的导通电阻不断增大，绝缘电阻的阻值不断降低。第6周期，绝缘电阻降低了一个数量级。第14周期，导通电阻的阻值增加了4.32~6.72 mΩ；绝缘电阻降至0.55~0.78 GΩ，降低了两个数量级，基本丧失绝缘性能。结论 实验室模拟海洋环境下，印制电路板腐蚀损伤历程可以分为表面镀层腐蚀、基底金属腐蚀发生与扩展、元器件芯腔内腐蚀失效3个阶段。 |
| 英文摘要: |
| This paper aims to study the corrosion damage behavior and law of printed circuit board in airborne equipment cabin in laboratory simulated marine environment. The accelerated corrosion test environment spectrum was compiled based on the measured marine environment data of the airborne equipment cabin of a certain type of aircraft. The accelerated corrosion test was carried out for the electroless nickel plated gold printed circuit board. The corrosion behavior parameters, such as macro and micro corrosion appearances, on resistance and insulation resistance, were used to analyze the general law of corrosion damage evolution of printed circuit boards in laboratory simulated marine environment. In simulated marine environment, the corrosion of printed circuit board was firstly induced from the pins and through-holes of components, which seriously affected the stability of electrical properties such as on resistance and insulation resistance. During the accelerated corrosion process, the on resistance of printed circuit board increased continuously, and the insulation resistance decreased. In the 6th cycle, the insulation resistance decreased by an order of magnitude. In the 14th cycle, the on resistance increased by 4.32~6.72 mΩ, and the insulation resistance decreased to 0.55~0.78 GΩ, by two orders of magnitude, and the printed circuit board basically lost its insulation performance. In conclusion, in simulated marine environment, the corrosion damage process of printed circuit board can be divided into three stages:surface coating corrosion, occurrence and expansion of base metal corrosion, and component core cavity corrosion and failure. |
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