| 梁爽,杨盼奎,武继将,江斌,李慧.动车组关键板卡失效分析与预防措施[J].装备环境工程,2021,18(12):109-115. LIANG Shuang,YANG Pan-kui,WU Ji-jiang,JIANG Bin,LI Hui.Failure Analysis and Preventive Measures of Key Board of Electric Multiple Units[J].Equipment Environmental Engineering,2021,18(12):109-115. |
| 动车组关键板卡失效分析与预防措施 |
| Failure Analysis and Preventive Measures of Key Board of Electric Multiple Units |
| 投稿时间：2021-05-10 修订日期：2021-07-15 |
| DOI：10.7643/issn.1672-9242.2021.12.017 |
| 中文关键词: 板卡 动车组 失效分析 加速应力 温湿度应力 失效预防中图分类号:U266 文献标识码:A 文章编号:1672-9242(2021)12-0109-07 |
| 英文关键词:circuit boards EMU failure analysis accelerated stress temperature and humidity stress prevention of board failure |
| 基金项目: |
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| Author | Institution |
| LIANG Shuang | CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao 266111, China |
| YANG Pan-kui | CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao 266111, China |
| WU Ji-jiang | CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao 266111, China |
| JIANG Bin | CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao 266111, China |
| LI Hui | GRG Metrology and Test Qingdao Co., Ltd., Qingdao 266111, China |
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| 中文摘要: |
| 目的 对动车组关键板卡进行失效分析，并提出预防改进措施。方法 通过对动车组运用过程中的环境分析，确定影响板卡性能的主要因素为温度与湿度应力。为缩短试验周期，设计恒温恒湿加速应力试验，快速暴露板卡及其元器件的薄弱环节。试验中受应力影响，板卡与元器件发生了不同程度的失效。通过对失效部件的物理化学性能进行分析，对板卡的使用环境与分析方法提出建议。结果 动车组板卡在高温高湿环境下的失效模式为电性能故障，由于密封不良，电感表面有纤毛和白色附着物，工作时温度过热导致漆包膜破损，从而使电感失效，焊点、PCB基材与三防漆未检测到失效老化。结论 电感、MOS管、电解电容等元器件受温湿度应力影响较大，且板卡的密封与使用环境也影响着板卡的使用寿命，日常使用应注重散热与密封。通过该项目研究为板卡失效预防提供了可行方法。 |
| 英文摘要: |
| The purpose of this paper is to carry out failure analysis and put forward improvement measures to the EMU key circuit board card. Through the analysis of the environment during the application of EMU (Electric Multiple Units), it is determined that the main factors affecting of EMU are temperature and humidity stress. In order to shorten the test period, the constant temperature and humidity accelerated stress test is designed in this paper to quickly expose the weak links of the board and its components. Under the influence of stress, the failure of board and components occurred in different degrees. Based on the analysis of the physical and chemical properties of the invalidation parts, suggestions for the application environment and analysis method of the board card are put forward. The failure mode of EMU circuit board in high temperature and humidity environment is electrical performance fault. The inductor has cilia and white attachment on the surface due to the poor seal of the board. Working at high temperature will lead to damage of paint coating and failure of inductance. Failure and aging of solder joint, PCB substrate and paint have not been detected. Inductance, MOS tube, electrolytic capacitor and other components are greatly affected by temperature and humidity stress. The sealing and service environment also affect the service life of the board. Heat dissipation and seal shall be paid attention to during daily use. This project also provides a feasible method for the prevention of board failure. |
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