| 刘学斌,丁光雨,郑兴帅,杜超群.武器装备典型故障和环境效应统计分析[J].装备环境工程,2022,19(4):46-53. LIU Xue-bin,DING Guang-yu,ZHENG Xing-shuai,DU Chao-qun.Statistical Analysis of Typical Faults and Environmental Effects of Weapons and Equipment[J].Equipment Environmental Engineering,2022,19(4):46-53. |
| 武器装备典型故障和环境效应统计分析 |
| Statistical Analysis of Typical Faults and Environmental Effects of Weapons and Equipment |
| 投稿时间：2021-08-21 修订日期：2022-01-03 |
| DOI：10.7643/issn.1672-9242.2022.04.008 |
| 中文关键词: 武器装备 环境效应与失效 统计分析 电子元器件中图分类号:TJ01 文献标识码:A 文章编号:1672-9242(2022)04-0046-08 |
| 英文关键词:weapons and equipment environmental effect and failures statistics and analysis electronic components |
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| 中文摘要: |
| 目的 针对武器装备典型故障环境效应进行统计并分析。方法 以收集到的208个试验故障为研究对象，统计分析近10年来武器装备进行环境试验后产生的各种环境效应，以及环境效应的分类、分布及失效原因等，获取武器装备环境试验失效的统计数据。结果 环境效应引起的故障主要集中在电子元器件和机械件的失效上，且电子元器件的失效所占比例在所有统计试验中占比最大。在环境试验中，高温、低温、振动等环境试验产生的环境效应和故障模式有所差别。结论 提出了加快针对信息化武器装备环境效应的基础设备建设和研究的投入力度，应对电子元器件故障比例攀升带来的挑战。 |
| 英文摘要: |
| This paper is to carry out statistics and analysis on the typical faults and environmental effects of weapons and equipment. In this practice, two hundred and eight test faults collected are taken as the research object, and various environmental effects produced by environmental tests of weapons and equipment in recent ten years are statistically analyzed, as well as the classification, distribution and failure causes of environmental effects, etc. The statistical data of environmental test failures of weapons and equipment are obtained. The failures caused by environmental effects mainly focus on the failure of electronic components and mechanical parts, and the failure rate of electronic components accounts for the largest proportion in all statistical tests. In environmental tests, environmental effects and failure modes produced by environmental tests such as high temperature, low temperature and vibration are different. It is proposed to accelerate the investment in infrastructure construction and research for the environmental effects of information weapons and equipment, and to cope with the challenges brought by the rising failure rate of electronic components. |
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