| 王旋,吴护林,李忠盛,宋凯强,丛大龙,黄安畏,张敏,丁星星,彭冬,白懿心,魏子翔.AlN覆铜板盐雾环境下的退化行为研究[J].装备环境工程,2023,20(7):142-149. WANG Xuan,WU Hu-lin,LI Zhong-sheng,SONG Kai-qiang,CONG Da-long,HUANG An-wei,ZHANG Min,DING Xing-xing,PENG Dong,BAI Yi-xin,WEI Zi-xiang.Degradation Behavior of Copper Metallized Aluminum Nitride in Salt Spray Environment[J].Equipment Environmental Engineering,2023,20(7):142-149. |
| AlN覆铜板盐雾环境下的退化行为研究 |
| Degradation Behavior of Copper Metallized Aluminum Nitride in Salt Spray Environment |
| 投稿时间：2022-11-16 修订日期：2022-11-29 |
| DOI：10.7643/issn.1672-9242.2023.07.018 |
| 中文关键词: AlN覆铜板 盐雾 导热系数 击穿电压 腐蚀产物 声子-缺陷散射中图分类号:TJ04 文献标识码:A 文章编号:1672-9242(2023)07-0142-08 |
| 英文关键词:copper metallized AlN salt spray thermal conductivity coefficient breakdown voltage corrosion products phonon-defect scattering |
| 基金项目: |
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| Author | Institution |
| WANG Xuan | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| WU Hu-lin | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| LI Zhong-sheng | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| SONG Kai-qiang | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| CONG Da-long | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| HUANG An-wei | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| ZHANG Min | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| DING Xing-xing | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| PENG Dong | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| BAI Yi-xin | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| WEI Zi-xiang | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
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| 中文摘要: |
| 目的 研究AlN覆铜板在盐雾环境下的性能退化及其微观机制。方法 采用交替喷雾和干燥方法对AlN覆铜板进行15周期的中性盐雾试验，并在第1、3、6、10、15周期时检测其相关性能。主要通过击穿电压测试、介电性能测试和导热性能测试等方法，分别评价AlN覆铜板的电绝缘特性、介电损耗及导热系数，并通过扫描电镜和能谱测试对试样表面/截面微观形貌和元素变化进行分析。结果 AlN覆铜板导热系数和击穿电压随盐雾试验周期的增长而逐渐退化，最大退化率分别为13.2%和73.8%。介电损耗明显增加，盐雾试验15周期后，在低频区域的最大值约为1.3。Cu电极发生明显腐蚀，生成大量绿色腐蚀产物，导致表面Ni-P镀层脱落失效。H2O分子扩散进入AlN陶瓷内部，在局部区域造成陶瓷水解，逐渐形成微裂纹。结论 盐雾试验过程中，Ni-P镀层逐渐开裂剥落，Cu电极表面最终形成大面积疏松多孔的腐蚀产物层。H2O、Cl–、Na+等逐渐溶解扩散进入AlN陶瓷，导致陶瓷中空位、裂纹、杂质缺陷浓度增加，二者都会增强导热过程中的声子-缺陷散射，进而导致AlN覆铜板导热系数退化。 |
| 英文摘要: |
| The work aims to study the degradation behavior and the corresponding micro-mechanism of copper metallized AlN in salt spray environment. A total of 15 cycles of neutral salt spray experiment were carried out on copper metallized AlN by alternate spray and drying methods, and the relevant properties were tested at the 1st, 3rd, 6th, 10th and 15th cycles. The electrical insulation characteristics, dielectric loss and thermal conductivity of copper metallized AlN were evaluated by breakdown voltage test, dielectric property test and thermal conductivity test. The surface/section morphology and element change of the samples were analyzed by SEM and EDS. The thermal conductivity and breakdown voltage of copper metallized AlN gradually degraded with the salt spray experiment period, and the maximum degradation rates was 13.2% and 73.8%, respectively. The dielectric loss increased obviously, and the maximum value was about 1.3 in the low frequency region after 15 cycles. The Cu electrode was obviously corroded, producing a large number of green corrosion products, which led to the failure of Ni-P coating on the surface. H2O diffused into the AlN ceramics, causing ceramic hydrolysis in local areas and gradually forming microcracks. During the salt spray experiment, the Ni-P coating gradually crack and peel off, and a large area of loose porous corrosion product layer is finally formed on the surface of the Cu electrode. H2O, Cl–, Na+ gradually dissolve and diffuse into AlN ceramics, resulting in the increase of vacancy, crack and impurity defect concentration in ceramics. Both of them enhance the phonon-defect scattering in the process of thermal conductivity, which leads to the degradation of thermal conductivity of copper metallized AlN. |
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