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| Development of Routine Test Equipment in Environmental Stress Screening |
| Received:February 05, 2014 Revised:March 18, 2014 |
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| DOI：10.7643/issn.1672-9242.2014.03.021 |
| KeyWord:routine test equipment temperature circle test environmental stress screening ( ESS ) change rate of temperature screening strength |
| Author | Institution |
| YANG Xi-cun |
Xi'an Electronic Project Institute, Xi'an , China |
| LI Ying |
Southwest Technology and Engineering Research Institute, Chongqing , China |
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| Abstract: |
| Objective To search for improvement methods based on the routine test equipment temperature cycle stress screening technology. Methods Ordinary thermal cycle test equipment was used, in combination with the actual screening circumstance of the army electronics product, to measure the actual temperature change rate inside the product during temperature cycle stress screening. These measurement results were then analyzed to find out the problems with this method, especially the poor correlation between the fault exposure and the stress screening. To solve this problem, the reasonable selection of temperature cycle screening parameters was analyzed. Results Tests with high theoretical screening strength ( e. g. , 0. 89) turned out to have low measured values of screening strength ( e. g. , 0. 54) . Conclusion The application of temperature cycle stress screening method and establishment of reasonable stress parameters could lead to ideal test results and save half of the test time. |
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