| The basic concept of failure physical model was proposed, and several common failure physical models for electronic products were introduced, such as interconnection thermal fatigue model, interconnection thermal fatigue model, interconnection vibration fatigue model, electro-migration model, and time-dependent dielectric breakdown model. Two modeling methods for failure physical models were proposed, including the damage modeling based on failure factors and the damage modeling based on failure processes. In combination with the engineering applications, two application methods of failure physical models were discussed, namely, reliability simulation analysis method and accelerated reliability test method. Finally, the research on failure physical models was prospected. |