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| Application of Digital Image Correlation Technique in Measuring Coefficient of Thermal Expansion at High Temperature |
| Received:January 25, 2016 Revised:June 15, 2016 |
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| DOI：10.7643/ issn.1672-9242.2016.03.006 |
| KeyWord:high temperature thermal deformation digital image-related techniques graphite thermal expansion coefficient |
| Author | Institution |
| XU Zhong-ying |
Center for Composite Materials, Harbin Institute of Technology, Harbin, China |
| WANG Wei |
Center for Composite Materials, Harbin Institute of Technology, Harbin, China |
| MENG Song-he |
Center for Composite Materials, Harbin Institute of Technology, Harbin, China |
| XIE Wei-hua |
Center for Composite Materials, Harbin Institute of Technology, Harbin, China |
| YI Fa-jun |
Center for Composite Materials, Harbin Institute of Technology, Harbin, China |
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| Abstract: |
| Objective To measure thermal expansion coefficient (CTE) of heat structures materials at high temperature. Methods Combining the digital image correlation (DIC) method and energized resistance heating technology, a test system for measuring high-temperature deformation and strain was established. After recording the surface images at different temperatures by a CCD camera, DIC method was used to analyze all the images to obtain the deformation and strain along with increasing temperature, and the corresponding thermal expansion coefficients at different temperatures were further calculated. This paper measured the thermal expansion coefficients of copper in the range of 600~800 ℃, and measured the graphite′ s CTE in the range of 600 ~1200 ℃, comparing with literature data. Results The CTE of copper was in the range of 600 ~800 ℃ and graphite in the range of 600~1200 ℃ as, measured by this system, showing that the data were in good agreement with the literature. Conclusion This method showed the ability to accurately measure thermal strain and CTE of conductive material, and its temperature limit reached up to 1200 ℃. |
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