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| Effects of Environment Temperature Rising Process on Thermodynamic Performance of Normal Temperature Curing Epoxy Resin |
| Received:September 14, 2017 Revised:February 15, 2018 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/ issn.1672-9242.2018.02.004 |
| KeyWord:normal temperature curing epoxy resin environment temperature rising curing gradient thermodynamic performance |
| Author | Institution |
| JIA Cai-xia |
Shenyang Aerospace University, Shenyang , China |
| LIANG Lu-zhong |
Shenyang Aircraft Corporation, Shenyang , China |
| WANG Qi |
Shenyang Aerospace University, Shenyang , China |
| WANG Qian |
Shenyang Aircraft Corporation, Shenyang , China |
| XIONG Xu-hai |
Shenyang Aerospace University, Shenyang , China |
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| Abstract: |
| Objective To improve the high temperature using performance of normal temperature curing epoxy resin system. Methods The normal temperature curing agent T31, the medium temperature curing agent IPDA and the high temperature curing agent DDM were used as the mixed curing agent for the normal temperature curing reaction of epoxy resin E-44 and AG-80 system, and to analyze influences of the environment temperature rising process on the thermodynamic performance. DMA analysis, thermal deformation measurement and curing degree test were taken to evaluate the changes of the glass transition temperature, the thermal deformation and the curing reaction in the epoxy resin system before and after the environment temperature rising process, respectively. The wet-heat resistance and the high temperature mechanical properties of glass fiber reinforced the epoxy resin composites were studied through water absorption test and three-point bending test. Results The tg of normal temperature curing epoxy resin was 85.21 ℃. After the heating process with average rate of 1.5 ℃/min to 90 ℃, the degree of cure increased to above 92%, the value of tg was 132.06 ℃ and the thermal deformation temperature ascended. The wet-heat resistance of the composites was improved and its bending strength retention was 65% at 100 ℃. For the environment temperature rising process to 120 ℃, the curing degree was close to 96%, the tg increased to 144.45 ℃ and the thermal deformation temperature raised further. The im-provement on wet-heat resistance of the composites was more obvious and its bending strength retention remained close to 60% at 130 ℃. Conclusion The mixed curing agent with rational matching including normal, medium, and high temperature curing agents helps to induce the curing gradient in the epoxy resin system under the condition of environment temperature increasing. During this process the degree of cross-linking in the system quickly rose to a higher level to improve the glass transition temperature and the thermodynamic performance at high temperatures of the room temperature curing epoxy resin significantly. |
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