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| Thermal Analysis and Evaluation Method of Typical Chip Package Based on Double Thermal Resistance Model |
| Received:April 27, 2018 Revised:July 25, 2018 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/ issn.1672-9242.2018.07.003 |
| KeyWord:chip double thermal resistance thermal analysis package |
| Author | Institution |
| SHEN Hai-dong |
1.CEPREI, Guangzhou , China; 2. Guangdong Provincial Key Laboratory of Electronic Information Products Reliability Technology, Guangzhou , China; 3. National Joint Engineering Center of Reliability Analysis and Testing Technology of Electronic Information Products, Guangzhou , China; 4. Guangdong intelligent robot Reliability Engineering Technology Research Center, Guangzhou , China |
| ZHANG Ze |
1.CEPREI, Guangzhou , China; 2. Guangdong Provincial Key Laboratory of Electronic Information Products Reliability Technology, Guangzhou , China; 3. National Joint Engineering Center of Reliability Analysis and Testing Technology of Electronic Information Products, Guangzhou , China; 4. Guangdong intelligent robot Reliability Engineering Technology Research Center, Guangzhou , China |
| CHEN Ke-wen |
1.CEPREI, Guangzhou , China; 2. Guangdong Provincial Key Laboratory of Electronic Information Products Reliability Technology, Guangzhou , China; 3. National Joint Engineering Center of Reliability Analysis and Testing Technology of Electronic Information Products, Guangzhou , China; 4. Guangdong intelligent robot Reliability Engineering Technology Research Center, Guangzhou , China |
| OU Yong |
5. CEPREI Laboratory Taizhou, Taizhou , China |
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| Abstract: |
| Objective To study thermal analysis and evaluation method of chip packaging based on double thermal resistance model, compare and analyze influences of different modeling methods on thermal analysis results. Methods The double thermal resistance model was used to establish a chip package model of ECU product and compare with calculation results of the "lumped parameter method" modeling method. An equivalent environment model was established according to the typical measured environment in this case, and the comparative analysis was carried out. Results The thermal simulation results of the device modeled by the double thermal resistance model were more accurate, and it could better reflect the actual thermal distribution of the chip package, thus it was easy to find the thermal design defects of the chip's heat dissipation measures. When the lumped parameter method was applied for modeling and analysis of chip package, the calculation error was relatively large, and the actual heat dissipation of the chip could not be accurately represented. On the other hand, the establishment of equivalent model of measured environment had great influence on the calculation results. Conclusion The double thermal resistance model can be better suitable for the simplified modeling of chip packaging. It has higher accuracy in the application of chip thermal analysis, and it is not difficult to obtain the parameters, so it has great engineering application value. |
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