|
| Reliability Evaluation and Analysis of Plastic Encapsulated Device Based on Temperature Cycle |
| Received:May 03, 2018 Revised:August 25, 2018 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/ issn.1672-9242.2018.08.016 |
| KeyWord:plastic encapsulated device temperature cycle evaluation reliability |
| Author | Institution |
| LI Yong-zheng |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| LI Xin-xin |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| DANG Wei |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| SUN Zhuo-wu |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| ZHANG Ze-ming |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
|
| Hits: |
| Download times: |
| Abstract: |
| Objective To assess thermal fatigue life and reliability of plastic encapsulated devices. Methods Low-level device evaluation standards of NASA and ECSS were analyzed and a temperature cycling evaluation scheme was developed for two types of plastic encapsulated devices used for a certain type of task. 500 cycles were carried out at 55~+125 ℃ with the external visual inspection, X-ray examination, scanning acoustic microscopy examination and electrical test. Results The SOP-8 (Small Out-line Package) device was qualified, and the test items were qualified, and its reliability life could meet the requirements single machine of a certain type of task for 2 years. The functions of SOT-23 (Small Out-line Transfer Package) were invalid, and the delamination was extended to the whole welding plate area. The internal bonding wire was broken and the failure rate of electrical parameters was 95%. Conclusion Evaluation of plastic encapsulated devices needs to develop a targeted evaluation plan. After evaluation and verification, and the reliability of some plastic encapsulated devices can meet the mission requirements of high reliability field through evaluation, with high reliability and high performance. |
| Close |
|
|
|