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| Failure Study of Electronic Components and PCB of Shipborne Weapon Equipment Based on Fault Tree Analysis |
| Received:September 28, 2023 Revised:November 07, 2023 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2024.01.003 |
| KeyWord:shipborne weapon equipment fault tree analysis failure analysis environmental adaptability electronic components printed circuit board |
| Author | Institution |
| WU Jinzhe |
School of Electronic Engineering, Naval University of Engineering, Wuhan , China |
| MA Zhiyuan |
School of Electronic Engineering, Naval University of Engineering, Wuhan , China |
| GUO Yueting |
School of Electronic Engineering, Naval University of Engineering, Wuhan , China |
| LEI Zengyao |
School of Electronic Engineering, Naval University of Engineering, Wuhan , China |
| WU Wenquan |
School of Electronic Engineering, Naval University of Engineering, Wuhan , China |
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| Abstract: |
| The work aims to study the failure of the multifunctional signal generator in the sonar system of a ship in an extreme ocean environment. Fault tree analysis was used as the basic method of failure analysis. Firstly, the micro-focus CT detection technology was used to accurately locate the failure of the sample. The failure mechanism of the sample was analyzed by scanning electron microscopy and energy spectrum analysis, and the mechanism factors and influencing factors of sample failure were summarized in combination with the application background. Finally, specific improvement schemes were proposed for each failure form. Due to the surface topography of the resistance itself, the rated temperature and the external environment (high temperature, high humidity, high salt), the water vapor containing salt spray entered the resistance, resulting in electrochemical migration inside the resistance, the resistance value was significantly reduced, and finally lead to the failure of the multi-function signal generator. The failure of electronic equipment, such as multi-function signal generators, is often caused by the combination of design and manufacturing and various marine environmental factors. This requires that the developers and users of shipborne electronic equipment should pay attention to the adaptability of the marine environment and take certain improvement measures. |
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