| 陈恒帅,朱德湛,赵凤奇,全婷,朱艳丽,姚洪志.桥丝火工品电极塞在直流激励下的热仿真与计算[J].装备环境工程,2024,21(11):1-9. CHEN Hengshuai,ZHU Dezhan,ZHAO Fengqi,QUAN Ting,ZHU Yanli,YAO Hongzhi.Thermal Simulation and Calculation of Bridgewire Electro-explosive Device Electrode Plug under DC Excitation[J].Equipment Environmental Engineering,2024,21(11):1-9. |
| 桥丝火工品电极塞在直流激励下的热仿真与计算 |
| Thermal Simulation and Calculation of Bridgewire Electro-explosive Device Electrode Plug under DC Excitation |
| 投稿时间：2024-09-13 修订日期：2024-10-09 |
| DOI：10.7643/issn.1672-9242.2024.11.001 |
| 中文关键词: 桥丝式电火工品 电极塞 集总参数法 热仿真 温升 热响应参数中图分类号:TJ450 文献标志码:A 文章编号:1672-9242(2024)11-0001-09 |
| 英文关键词:bridgewire electro-explosive device electrode plug lumped parameter method thermal simulation temperature rise thermal response parameter |
| 基金项目:重庆市自然科学基金(CSTB2023NSCQ-MSX0662)；国家自然科学基金(52374298) |
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| Author | Institution |
| CHEN Hengshuai | State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing 100081, China |
| ZHU Dezhan | State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing 100081, China |
| ZHAO Fengqi | State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing 100081, China |
| QUAN Ting | State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing 100081, China |
| ZHU Yanli | State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing 100081, China |
| YAO Hongzhi | State Key Laboratory of Transient Chemical Effects and Control, Shaanxi Applied Physics and Chemistry Research Institute, Xi'an 710061, China |
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| 中文摘要: |
| 目的 获得桥丝火工品电极塞在直流激励下的温升特点，并基于集总参数法，拟合计算桥丝温升。方法 使用COMSOL软件仿真计算电极塞的直流加热过程，得到电极塞的温升和温度分布。对仿真温升进行拟合，得到集总参数方程中的桥丝热响应参数。改变激励电流，计算桥丝温升，并与仿真结果比较。结果 在50 mA电流下，桥丝温度呈现由中部向两端降低的趋势，10 ms后，桥丝的平均温升稳定在160 K。桥丝以外区域温度远低于桥丝温度，接近环境温度。对仿真桥丝平均温升拟合得到桥丝热容和热损耗系数分别为1.796 7×10–7 J/K和9.296 0×10–5 W/K，热时间常数为1.932 8 ms。在70 mA电流下，计算得到的桥丝温升稳定在314 K，并与仿真结果接近。在50 mA电流下，实际焊点模型的桥丝平均温升较简化焊点模型降低了约26 K，热时间常数降低约0.06 ms。结论 拟合得到了桥丝集总参数方程中的热响应参数，验证了集总参数法在计算桥丝平均温升的适用性。由于脚线温度与环境接近，桥丝热耗散功率基本正比于桥丝温升，与集总参数方程中的热耗散项相符。由于实际焊点模型的桥丝长度增加，导致热容和热损耗系数均增大，而热容增加倍率略大于热损耗系数。 |
| 英文摘要: |
| The work aims to study the temperature rise characteristics of the bridgewire electro-explosive device electrode plug under DC excitation and calculate the temperature rise of the bridgewire based on the lumped parameter method. The COMSOL software was adopted to simulate and calculate the DC heating process of the electrode plug. The temperature rise and distribution of the electrode plug were obtained. The thermal response parameters of the bridgewire in the lumped parameter equation were obtained by fitting the simulated temperature rise. The temperature rise of the bridgewire under another excitation current was obtained by the formula and compared with the simulation result. Under 50 mA current, the temperature of the bridgewire showed a decreasing trend from the middle to both ends. The average temperature rise of the bridgewire was stable at 160 K after 10 ms. The temperature outside the bridgewire was much lower than that of the bridgewire and close to the ambient temperature. By fitting the simulated average temperature rise of the bridgewire, the heat capacity and heat loss factor of the bridgewire were determined to be 1.796 7×10–7 J/K and 9.296 0×10–5 W/K, respectively, resulting in a thermal time constant of 1.9328 ms. Under 70 mA current, the temperature rise of the bridgewire calculated by the formula was stable at 314 K and close to the simulated results. Under 50 mA current, the average temperature rise of the bridgewire in the actual solder joint model decreased by about 26 K compared to the simplified solder joint model. The thermal time constant was reduced by about 0.06 ms.The thermal response parameters of the bridgewire in the lumped parameter equation are fitted. The applicability of the lumped parameter method in calculating the average temperature rise of bridgewire is verified. Since the temperature of the pin wires is close to the ambient temperature, the thermal loss power of the bridgewire is basically proportional to the temperature rise of the bridgewire, which is consistent with the heat loss term in the lumped parameter equation.The actual solder joint model has an increase in heat capacity and heat loss factor due to the increase of bridgewire length. The increase rate of heat capacity is slightly greater than that of heat loss factor. |
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