| 张云,杜韩东,谢兰川,王竟成,滕玉凤,张浩明.粘接模式对温度载荷发动机药柱力学响应影响仿真分析[J].装备环境工程,2024,21(12):17-27. ZHANG Yun,DU Handong,XIE Lanchuan,WANG Jingcheng,TENG Yufeng,ZHANG Haoming.Simulation Analysis on Influence of Bonding Mode on Mechanical Response of Engine Grain under Temperature Load[J].Equipment Environmental Engineering,2024,21(12):17-27. |
| 粘接模式对温度载荷发动机药柱力学响应影响仿真分析 |
| Simulation Analysis on Influence of Bonding Mode on Mechanical Response of Engine Grain under Temperature Load |
| 投稿时间：2024-10-17 修订日期：2024-11-25 |
| DOI：10.7643/issn.1672-9242.2024.12.003 |
| 中文关键词: 发动机药柱 温度载荷 黏弹性 粘接模式 仿真分析 应力 应变中图分类号:V512 文献标志码:A 文章编号:1672-9242(2024)12-0017-11 |
| 英文关键词:engine grain temperature load viscoelastic bonding mode simulation analysis stress strain |
| 基金项目: |
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| Author | Institution |
| ZHANG Yun | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| DU Handong | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| XIE Lanchuan | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| WANG Jingcheng | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| TENG Yufeng | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
| ZHANG Haoming | Southwest Institute of Technology and Engineering, Chongqing 400039, China |
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| 中文摘要: |
| 目的 仿真分析温度载荷环境下固体发动机药柱的力学响应，为药柱与壳体粘接模式方案优选提供指导。方法 利用瞬态热力耦合数值模拟方法，对考虑药柱黏弹性本构性的缩比件模型进行仿真计算并试验验证，将验证后的模拟方法应用于全尺寸装药结构力学响应数值计算，分析不同药柱与壳体粘接模式装药结构在不同温度载荷环境下的应力应变变化情况。结果 不同尺寸缩比件模型的模拟计算结果与试验测量值的误差均小于8%，且试验前后探伤未发现药柱异常，试验与计算结果吻合。侧面加底部粘接模式的全尺寸装药结构的药柱在3种温度载荷环境下，von Mises应力、应变极值均大于底部粘接模式的药柱。结论 采用底部粘接模式比侧面加底部粘接模式对药柱结构完整性的安全系数有显著提高，其中低温冲击试验中底部粘接模式优势尤为明显。 |
| 英文摘要: |
| The work aims to conduct a simulation analysis on the mechanical response of solid engine grains under temperature load environments to provide guidance for the optimization of grain-to-case bonding mode schemes. The transient thermal-mechanical coupling numerical simulation method was used to conduct simulation calculations on the scaled-down component models considering the viscoelastic constitutive properties of grains, and conduct experimental verification. The verified simulation method was applied to the numerical calculation of the mechanical response of full-scale charge structures. The stress and strain changes of charge structures with different grain-to-case bonding modes under different temperature load environments were analyzed.In scaled-down component models of different sizes, the errors between simulated and the experimental measured value were less than 8%. Moreover, no abnormal grains were found by flaw detection before and after the test. The calculation results matched the test results. For the grains of full-scale charge structures with side plus bottom bonding mode under three temperature load environments, the von Mises stress and von Mises strain extremes were all greater than those of grains with bottom bonding mode. In conclusion, the safety factor of the structural integrity of the grain is significantly improved by adopting the bottom bonding mode compared with the side and bottom bonding mode. Among them, the advantage of the bottom bonding mode is particularly obvious in the low-temperature impact experiment. |
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