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| Study on Temperature Effect of Plastic Encapsulated Microcircuit |
| Received:September 01, 2012 Revised:December 15, 2012 |
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| DOI： |
| KeyWord:plastic encapsulated temperature effect defects |
| Author | Institution |
| LU Hao-tian |
China Aero-polytechnology Establishment， Beijing ， China |
| LU Xiao-qing |
China Aero-polytechnology Establishment， Beijing ， China |
| CAI Liang-xu |
China Aero-polytechnology Establishment， Beijing ， China |
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| Abstract: |
| Failure analysis of plastic encapsulated microcircuit in temperature recycle test was carried out by using non-destructive technique and destructive microscopy analysis technique. The development of defects was studied. Suggestions were put forward on improvement of device design and existing standards. |
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