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| Direct Plating Technology for PTH Nano-carbon |
| Received:August 20, 2012 Revised:January 01, 2013 |
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| DOI： |
| KeyWord:nano-carbon plated through hole direct plating |
| Author | Institution |
| DUAN Yuan-fu |
South-center Electronic Chemical Material Institute，Wuhan，China |
| GAO Si |
South-center Electronic Chemical Material Institute，Wuhan，China |
| ZHANG Wei |
South-center Electronic Chemical Material Institute，Wuhan，China |
| HUANG Rui |
South-center Electronic Chemical Material Institute，Wuhan，China |
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| Abstract: |
| The emergence of nano-carbon direct plating is a challenge to traditional PTH. The characteristic of nano-carbon direct plating is that substitute traditional chemical copper plating and direct plating through conductive film formed by physical effect. The process of nano-carbon direct plating is simplified; controlling factors of the process are reduced; chemical reagents used are less compared with traditional PTH. The process has the advantages of shorter production circle, greatly improved production efficiency, environment friendly, and less waste water treatment costs, which reduces total printed circuit board manufacturing costs. |
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