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| Solution to Waterproof Problem of Moisture Deposition in Temperature Cycle Test |
| Received:October 13, 2012 Revised:March 01, 2013 |
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| DOI： |
| KeyWord:temperature cycle test control subsystem components water logging failure analysis |
| Author | Institution |
| YANG Xi-cun |
No.206Institute of China Ordnance Industry，Xi’an，China |
| SHAN Jun-yong |
No.206Institute of China Ordnance Industry，Xi’an，China |
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| Abstract: |
| If anti-waterlogging measures of ordnance electronic products are not taken in temperature cycle test, or if it is taken improperly, water vapor of test box will condense on the components of the subsystem. Thus, the components will have a leakage of electricity and abnormal performance, which will make the whole system failure. The failure components in the subsystem temperature shock test were analyzed. The causes of failure anti-condensation measures were put forward. A solution to the protection measures of anti-condensation in the temperature shock test was provided. |
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