High Temperature Storage Test Method of Electronic Component Based on Bayes
Received:February 24, 2013  Revised:July 01, 2013
View Full Text  View/Add Comment  Download reader
DOI:10.7643/issn.1672-9242.2013.04.006
KeyWord:将工厂试验数据作为先验信息,应用Bayes方法确定电子元件高温贮存试验的试样数量,其结果明显少于GJB345A—2005中规定的试样数量。基于不同试验结果,通过构建寿命模型和确定先验分布,分别得到了电子元件的寿命分布和失效概率的Bayes估计。electronic component  high temperature storage test  accelerated life test  zero-failure data  Bayes estimation
           
AuthorInstitution
CHENG Ze Ordnance Engineering College,Shijiazhuang,China
XUAN Zhao-long Ordnance Engineering College,Shijiazhuang,China
LIU Ya-chao Ordnance Engineering College,Shijiazhuang,China
HAO Mao-sen The Military Representative Office of Engineer Military Representative Bureau in Xi’an and Lanzhou,Xi’an,China
Hits:
Download times:
Abstract:
      Based on the factory test data, the samples of electronic component high temperature storage test were determined based on Bayes, which are less than the samples defined by GJB345A-2005. The lifetime distribution of electronic component and the Bayes estimation of failure probability were obtained by structuring lifetime model and determining prior distribution based on the different test results.
Close