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| Electronic Components Failure Mode Test and Simulation Study |
| Received:September 12, 2013 Revised:October 25, 2013 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2013.06.011 |
| KeyWord:electronic components failure mode creep FEM |
| Author | Institution |
| ZHU Guang-teng |
Nanjing University of Science and Technology，Nanjing，China |
| GU Xiao-hui |
Nanjing University of Science and Technology，Nanjing，China |
| FANG Dao-hong |
No.78666Unit of PLA. China，Yiliang，China |
| XIAO Kun |
Nanjing University of Science and Technology，Nanjing，China |
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| Abstract: |
| Objective To investigate the equivalent stress and equivalent creep strain of lead-free solder joints under thermal stress.Methods The ultimate adaptive temperature of the electronic components was verified through staircase pattern increased temperature. The ultimate working temperature and damaging temperature of the electronic components were tested, and the main failure mode of electronic components was obtained. Subsequently, the stress and strain of solder behavior was simulated by FEM. ResultsThe simulation results were corresponded with the experimental results.Conclusion Our results provided reliable evidence on how to control the solder joint shape and proved that the Garofalo method is feasible to improve the electronic components’life period. |
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