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| Study on the Method of Thermodynamics Model Updating of Printed Circuit Board Assembly |
| Received:July 14, 2014 Revised:August 19, 2014 |
| View Full Text View/Add Comment Download reader |
| DOI：10. 7643 /issn. 1672-9242. 2014. 05. 023 |
| KeyWord:Latin hypercube sampling Speraman rank correlation coefficient parameter screening thermodynamics model updating |
| Author | Institution |
| WANG Kai-shan |
Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing , China |
| LI Chuan-ri |
Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing , China |
| GUO Heng-hui |
Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing , China |
| PANG Yue-chan |
Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing , China |
| LI Peng |
Reliability and System Engineering Institute, Beijing University of Aeronautics and Astronautics, Beijing , China |
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| Abstract: |
| Objective To update the thermodynamics model of the printed circuit board assembly accurately and efficiently. Methods The input parameters with great effects on the surface temperature of a component in the thermal simulation test were found out through the correlation analysis method which was based on the Latin hypercube sampling experiment design and the computational formula of Speraman rank correlation coefficient. And then the function relationship between the input and output was obtained after further analysis. On this basis, the general process of the thermodynamics model updating of the printed circuit board assembly was provided. Finally, the thermodynamics model of a PCBA from an aircraft electronic product was updated with this method. Results The result of the updated model showed good accuracy and only two calls to finite element software. Conclusion This method of thermodynamics model updating had good accuracy and efficiency, and could be used in engineering practice. |
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