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| Thermal Simulation and Thermal Test Analysis of Heat Radiation Design for Control Box |
| Received:September 03, 2014 Revised:February 15, 2015 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2015.01.019 |
| KeyWord:electronic components electronic equipment thermal analysis thermal design thermal test |
| Author | Institution |
| XU Lian-hu |
AVIC China Airborne Missile Academy，Luoyang ，China |
| YANG Ke |
AVIC China Airborne Missile Academy，Luoyang ，China |
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| Abstract: |
| Objective To conduct heat radiation design and thermal analysis for the control box of an emitting device. Methods In order to obtain the temperature contours inside the box and the temperature values of the components with obvious temperature increase, the thermal simulation model of the box was built on the basis of the thermal simulation software FLOTHERM, and then thermal test was carried out for this device. Results Thermal simulation and thermal test results indicated that there were components with high heat radiation and temperature increase inside the emitting control box, but the temperatures of all components were within the allowable normal operating temperature range. Conclusion Thermal analysis indicated that the thermal design of the device basically fulfilled the requirements, which also provides reference for the optimization of structure design. |
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