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| Finite Element Modeling for PBGA Components Based on RSM modification |
| Received:October 07, 2015 Revised:April 15, 2016 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2016.02.010 |
| KeyWord:PBGA modal test FE modeling RSM model modification |
| Author | Institution |
| ZHANG Da-peng |
Reliability and System Engineering Institute， Beihang University， Beijing ， China |
| LI Chuan-ri |
Reliability and System Engineering Institute， Beihang University， Beijing ， China |
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| Abstract: |
| Objective A specially designed fixture was used to mimic the typical boundary condition of plug-in PCB. A procedure based on response surface method (RSM) was proposed for modifying the finite element (FE) model of plastic ball grid array (PBGA) components mounted on daisy chain PCB. Methods The FE models were updated by RSM in three stages. In each stage, the first three resonant frequencies were calculated and contrasted with corresponding modal test results. Two objective functions were created and the difference between the simulation analysis and modal test results was minimized using a multi-objective genetic algorithm (MOGA). Results The FE model was effectively improved. Conclusion RSM could be used to improve the accuracy of the FE model in a practical way. |
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