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| Encapsulation and Reinforcement Technology of Electronic Devices |
| Received:March 18, 2016 Revised:August 15, 2016 |
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| DOI：10.7643/ issn.1672-9242.2016.04.025 |
| KeyWord:electronic device materials three-defense technology encapsulating technology reinforcement technology |
| Author | Institution |
| XU Lei |
Xi′an Electronic Engineering Research Institute, Xi′an , China |
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| Abstract: |
| To meet the requirements on environmental adaptability and reliability of electronic devices, this work focuses on the encapsulation and reinforcement technology of electronic devices on the basis of the traditional "three-defense". It introduced the performance of commonly used encapsulating and reinforcement materials and specified the encapsulation and reinforcement process for specific devices. Two encapsulating materials with impact resistance at 8×103g～20×103g were put forward for seeker. It provided a basis for "three-defense" design and material selection and offered practical experience and technical requirements for process protection so as to avoid quality problem that was caused by fault. Encapsulation and reinforcement technology of electronic devices can improve the protective performance of electronic products and has a certain guiding role. |
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