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| Thermal Fatigue Life Predication Model of Solder Joints for SMT-PGA Package |
| Received:August 30, 2016 Revised:January 15, 2017 |
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| DOI：10.7643/ issn.1672-9242.2017.01.006 |
| KeyWord:thermal fatigue SMT-PGA package solder joint engineering factor F |
| Author | Institution |
| XIA Li-jiao |
China Academy of Information and Communication Technology, Beijing , China |
| LI Xiao-yan |
China Aero-Polytechnology Establishment, Beijing , China |
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| Abstract: |
| Objective To study the thermal fatigue life prediction model of solder joints for SMT-PGA package. Methods The thermal fatigue life of SMT-BGA package solder joints was predicted based on the Engelmaier model; and then it was compared with simulation results of CALCE PWA life assessment software of University of Maryland. Results The calculated results were quite different from the simulation results of CALCE PWA software. Conclusion Engineering factor F in the Engelmaier model is not a fixed constant but affected by the minimum steady state temperature of package. |
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