|
| Thermal Fatigue Failure of Solder Joints Considering Randomness of Parameters |
| Received:November 08, 2016 Revised:April 15, 2017 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/ issn.1672-9242.2017.04.020 |
| KeyWord:solder joint thermal fatigue probability evaluation Monte Carlo |
| Author | Institution |
| SHEN Hai-dong |
School of Reliability and System Engineering, Beihang University, Beijing , China |
| LI Zhi-qiang |
School of Reliability and System Engineering, Beihang University, Beijing , China |
| WU Jun-yi |
School of Reliability and System Engineering, Beihang University, Beijing , China |
|
| Hits: |
| Download times: |
| Abstract: |
| Objective To research influences of geometric parameters on the thermal fatigue life of solder joints. Methods Based on the Engelmaier model, the variant form of Coffin-Masson’s and lead package of multiparameter randomness, a solder fatigue life probability evaluation model was established. Monte Carlo method was adopted to verify the accuracy of the model. SMT (Surface Mount Technology) gull-wing TSOP062 package was taken as an example. Quantitative analysis on influences of geometrical parameters of solder joints on thermal fatigue life was carried out. Results The fatigue life of solder joint decreased with the increase of geometric parameters discrete coefficient. The more random variable of geometric parameters, the lower reliability of solder joints. The height of welder joint was a sensitive parameter which affects the thermal fatigue life of elements. Conclusion This method can predict the whole batch thermal fatigue life of products, reduce the test time and cost greatly, and improve reliability of product and equipment on the premise that information on parameter fluctuation of small batch product is obtained.. |
| Close |
|
|
|