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| Thermal Design Research on Electronic Product in Space Station Utilization System |
| Received:March 20, 2017 Revised:June 15, 2017 |
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| DOI：10.7643/ issn.1672-9242.2017.06.002 |
| KeyWord:space station utilization system electronic equipment thermal design simulation analysis thermal balance test |
| Author | Institution |
| XIN Min-cheng |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| LI Peng |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| ZOU Tian-ji |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| ZHANG Hai-tao |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
| LIU Kai |
Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing , China |
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| Abstract: |
| Objective A thermal simulation analysis method based on temperature data measured from heating components in thermal balance test was proposed in allusion to inaccurate simulation analysis method for thermal design of electronic equipment in manned space flight application system. Methods After the in-depth analysis on electronic product’s in-orbit thermal condition for space utilization, a thermal model was established by computer simulation software with the knowing of physical properties, electrical characters and technical features. The temperature simulation results of the heat generating components’ shell were compared with their practical measured data from thermal balance test, and the accuracy of the thermal model was tested Results The thermal balance test was conducted on an electronic product under the condition that vacuum was 1.0×10-4 Pa, and temperature was 45 ℃. The temperature difference between simulation and measured data was less than 1 ℃. In the heat balance test, when switching different working modes, the difference between the thermal load indexes calculated based on the working current and voltage of components and thermal consumption value obtained in simulation was less than 0.1 W. Conclusion According to data measured from heating components in thermal balance test, the thermal design method for electronic equipment of thermal simulation analysis is tested to be feasible and effective, and it is favorable for future thermal design on electronic product in space station utilization system. |
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