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| Engineering Design on Temperature Uniformity of Source Array with High Heat Flux |
| Received:March 18, 2017 Revised:August 15, 2017 |
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| DOI：10.7643/issn.1672-9242.2017.08.015 |
| KeyWord:temperature uniformity micro-channel phase change heat transfer integrated design |
| Author | Institution |
| WENG Xia |
Southwest Institute of Electronics Technology, Chengdu , China |
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| Abstract: |
| Objective To research an engineering design technique on temperature uniformity of TR components in High Heat Flux Methods Based on the principle of phase change heat transfer in micro-channel, the temperature in micro-channel everywhere was kept within the temperature nearby the phase change point to reduce the difference between heat sources. The digital model for the integrated thermal physical prototype was set up. Stable flow and heat transfer of the prototype were analyzed by numerical si-mulation. Results The feasibility of lumped parameter simulation was verified. The distribution of flow field and temperature field were obtained. Conclusion After enhancing heat transfer by phase change in micro-channel of the prototype, the temperature dif-ference between different heat sources is small enough. It might be applied in engineering programs. |
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