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| UV Curing Kinetics and Performance of Organic Silicon Modified Epoxy Resin |
| Received:November 14, 2017 Revised:February 15, 2018 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/ issn.1672-9242.2018.02.002 |
| KeyWord:UV curing epoxy resin organic silicon dielectric analysis |
| Author | Institution |
| HU Fang-you |
Department of Aeronautical and Mechanical Engineering, Qingdao Branch, Naval Academy of Aeronautical Engineering, Qingdao , China |
| YU Zhou-hui |
Department of Aeronautical and Mechanical Engineering, Qingdao Branch, Naval Academy of Aeronautical Engineering, Qingdao , China |
| HE Xi-chang |
Army Engineering University, Xuzhou , China |
| ZHAO Pei-zhong |
Department of Aeronautical and Mechanical Engineering, Qingdao Branch, Naval Academy of Aeronautical Engineering, Qingdao , China |
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| Abstract: |
| Objective To study curing behaviors and properties of UV cured organic silicone modified epoxy resin. Methods The effects of amount of photo/thermal initiator, organic silicon on UV curing process of cycloaliphatic epoxy acrylate were studied by dielectric analysis (DEA). The property of organic silicon modified epoxy resin was analyzed by TG, DSC and microhardness tester. Results Photo/thermal initiator had the effect of cooperative complementary on curing effect. Increasing the amount of photo/thermal initiator could shortened the initiation time, speeded up the curing rate and improved the efficiency of curing. Compared with pure epoxy resin, curing efficiency and initial decomposition temperature of silicon modified epoxy resin decreased while decomposition rate decreased in high temperature and the char yield was also improved at 500℃. With the addition of 10% organic silicon content, cured films showed good resistance and the Vickers hardness of the resin could reach 37.15HV. Conclusion UV light can effectively cure the modified epoxy resin. |
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