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| Optimization Design and Experimental Study on Heat Pipe Cold Plate for Electronic Equipment |
| Received:July 13, 2019 Revised:August 18, 2019 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2020.01.017 |
| KeyWord:heat pipe cold plate thermal resistance network normal temperature test high temperature test |
| Author | Institution |
| ZENG Le-ye |
Hunan Branch of Beijing StarElec Technology Co., Ltd., Changsha , China |
| LI Xiang |
School of Aeronautics and Astronautics, UESTC, Chengdu , China |
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| Abstract: |
| The paper aims to solve the heat dissipation problem of electronic equipment chip with high heat flux density. A thermal resistance network of the conduction cooling for the mother board was built, and a heat pipe cold plate with low thermal resistance was designed and manufactured, then normal and high temperature tests of the two types of heat pipe cold plate for module and equipment were carried out under different heat fluxes. The normal temperature tests showed that the temperatures of the CPU and GPU were reduced by 14.3 ℃ and 5.4 ℃ respectively during the module tests, and which were dropped by 7.2 ℃ and 6.1 ℃ respectively during the equipment tests. The high temperature tests showed that the temperature of the CPU and GPU were reduced by 10.2 ℃ and 4.2 ℃ respectively during the module tests, and which were dropped by 9.1 ℃ and 7.5 ℃ respectively during the equipment tests. The heat pipe cold plate can improve the environmental adaptability and reliability of the equipment. This structure design method can be applied to electronic equipment cooling. |
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