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| Reliability Prediction for Integrated Controller Circuit Board Based on Physics of Failure |
| Received:August 26, 2020 Revised:September 28, 2020 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2021.04.020 |
| KeyWord:electric vehicles physics of failure stress analysis failure mode and mechanism effect analysis reliability prediction reliability design |
| Author | Institution |
| LIU Ling |
TongJi University, Shanghai , China |
| SUN Fu-qiang |
Beihang University, Beijing , China |
| ZHANG Tong |
TongJi University, Shanghai , China |
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| Abstract: |
| In order to achieve the reliability prediction and improvement of the integrated controller of commercial electric vehicles, the method of combining stress simulation and physics of failure is used to predict the reliability of its key circuit boards. The thermal and vibration simulation stress analysis was carried out for the digital prototype of the integrated controller. The failure mode mechanism and effect analysis (FMMEA) method is used to analyze the possible failure modes and failure mechanisms of the printed circuit board, and the failure physical model of the potential failure mode is determined. The results of the stress analysis are used as the input of the failure physical model, the reliability prediction based on the physics of failure is performed, the weak points of the design are found, and the improvement measures are proposed. Through the thermal simulation and vibration simulation analysis of the key circuit board of the integrated controller, eight high-temperature devices and thermal concentration areas of the circuit board are found. The vibration simulation analysis shows that the top and center vibration strength of the circuit board is large, which may cause fatigue failure, so attention should be paid to it. FMMEA analysis shows that the main failure mode of the circuit board is solder joint cracking, which is mainly affected by temperature cycling and caused thermal fatigue failure. Finally, the Coffin-Mason model was used to calculate the average failure interval of the circuit board is 15869 h, and the weak links of the circuit board reliability design can be found out. This method is based on physics of failure, which is more accurate than the traditional manual-based reliability prediction method. At the same time, it can be parallel with performance design during the product development stage. It can achieve the purpose of forward reliability design by analyzing and improving the product design, for the new energy automotive electronic product reliability prediction is expected to provide new ideas. |
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