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| Experimental Design and Simulation Analysis of Thermoelectric Coupling of Aviation Electrical Connector |
| Received:January 30, 2021 Revised:February 15, 2021 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2021.06.011 |
| KeyWord:aeronautical electrical connector thermoelectric coupling test design modeling and simulation COMSOL |
| Author | Institution |
| ZHANG Tong |
Naval Aviation University, Yantai , China |
| YU Da-zhao |
Naval Aviation University, Yantai , China |
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| Abstract: |
| In order to provide theoretical support for multi stress test, the coupling effect between stresses is studied deeply. Based on the existing equipment, the typical thermal coupling test of J599 Ⅲ electrical connector is designed and the test results are analyzed. SOLIDWORKS is used to model the electrical connector, then COMSOL multiphysics is used to analyze the thermoelectric coupling, and the results are compared with the experimental results. When the current is 1 A, the maximum temperature of the contact surface is located in the contact area between the pin and the socket. The maximum temperature is 24.4 ℃, the temperature rise is 0.1 ℃, and the temperature at the center of the contact area of the pin is the highest, reaching 26.7 ℃. When the current is 8 A, a temperature rise of about 6 ℃ can be produced. The simulated temperature rise is slightly higher than the experimental value. The contact resistance increases with the increase of temperature. Temperature and load will cause the temperature rise and contact resistance of the contact part of the electrical connector. |
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