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| Failure Analysis and Preventive Measures of Key Board of Electric Multiple Units |
| Received:May 10, 2021 Revised:July 15, 2021 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7643/issn.1672-9242.2021.12.017 |
| KeyWord:circuit boards EMU failure analysis accelerated stress temperature and humidity stress prevention of board failure |
| Author | Institution |
| LIANG Shuang |
CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao , China |
| YANG Pan-kui |
CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao , China |
| WU Ji-jiang |
CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao , China |
| JIANG Bin |
CRRC Qingdao Sifang Locomotive & Rolling Stock Co., Ltd., Qingdao , China |
| LI Hui |
GRG Metrology and Test Qingdao Co., Ltd., Qingdao , China |
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| Abstract: |
| The purpose of this paper is to carry out failure analysis and put forward improvement measures to the EMU key circuit board card. Through the analysis of the environment during the application of EMU (Electric Multiple Units), it is determined that the main factors affecting of EMU are temperature and humidity stress. In order to shorten the test period, the constant temperature and humidity accelerated stress test is designed in this paper to quickly expose the weak links of the board and its components. Under the influence of stress, the failure of board and components occurred in different degrees. Based on the analysis of the physical and chemical properties of the invalidation parts, suggestions for the application environment and analysis method of the board card are put forward. The failure mode of EMU circuit board in high temperature and humidity environment is electrical performance fault. The inductor has cilia and white attachment on the surface due to the poor seal of the board. Working at high temperature will lead to damage of paint coating and failure of inductance. Failure and aging of solder joint, PCB substrate and paint have not been detected. Inductance, MOS tube, electrolytic capacitor and other components are greatly affected by temperature and humidity stress. The sealing and service environment also affect the service life of the board. Heat dissipation and seal shall be paid attention to during daily use. This project also provides a feasible method for the prevention of board failure. |
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