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| Life Extension Analysis of Electronic Component |
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| DOI：10.7643/issn.1672-9242.2022.08.001 |
| KeyWord:s International, Volume:68-05, Section:B, page:3354. Adviser:Suresh K. Sita, 2007. |
| Author | Institution |
| XU Peng-bo |
Naval Aviation University, Shandong Yantai , China |
| LI Yong-qiang |
Naval Aviation University, Shandong Yantai , China |
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| Abstract: |
| Due to the high reliability of military electronic equipment and the inability of tests before installation to fully simulate the real service environment, the reference of the test results is not significant. This paper will use the task profile of the electronic component as a basis to refer to the key factors affecting the life of the electronic component when making the environmental load spectrum. The mechanism model of fatigue failure of electronic components and solder joints is used as the theoretical basis. Furthremore, when drawing CAD models of electronic components, it is necessary to make appropriate simplification and use ANSYS software to carry out finite element simulations under multi-load coupling, thereby finding out the weak points of electronic components and predict the life of key parts, which provides reference for the preliminary diagnosis of military electronic equipment failure and equipment life extension analysis. |
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