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| Experiment and Simulation Research on Heat Transfer Performance of Stainless Steel Plate Heat Sink |
| Received:October 07, 2023 Revised:November 15, 2023 |
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| DOI：10.7643/issn.1672-9242.2024.01.007 |
| KeyWord:plate heat sink heat transfer performance numerical simulation static implicit algorithm thermal resistance |
| Author | Institution |
| YIN Dayong |
Beijing Institute of Spacecraft Environment Engineering, Beijing , China |
| GONG Jie |
Beijing Institute of Spacecraft Environment Engineering, Beijing , China |
| ZHOU Ying |
Beijing Institute of Spacecraft Environment Engineering, Beijing , China |
| YANG Xue |
Beijing Institute of Spacecraft Environment Engineering, Beijing , China |
| JIN Weian |
Beijing Institute of Spacecraft Environment Engineering, Beijing , China |
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| Abstract: |
| The work aims to study the effect of flow, bulge height and solder joint arrangement on the heat transfer performance of the stainless steel plate heat sink. The experimental platform was established, and the plate heat sinks with different structural parameters were processed as the experimental specimens. Meanwhile, the corresponding geometric models were established by static implicit algorithm. Through the combination of experiment and numerical simulation, the effect rule of flow, bulge height and solder joint arrangement on thermal resistance of the plate heat sink was studied, and the internal flow field state of the heat sink was analyzed. Firstly, the thermal resistance under 6 working conditions was calculated. When the actual heat exchange was 540 W, the maximum relative error between the numerical simulation and the experimental results was not more than 25%. Then, the source of the error was analyzed. Finally, the distribution of velocity field and temperature field of the heat sink flow path was obtained. The experiment and simulation results have a good degree of compliance, which proves the reliability of the numerical simulation method. The thermal resistance of the plate heat sink decreases with the increase of the flow and bulge height when the heat exchange is the same, while the heat transfer performance under the solder joint arrangement with rhombic form is relatively better. The internal flow field of the plate heat sink is periodic, and the solder joints enhance the fluid disturbance and generate jets and eddies, which has the effect of strengthening heat transfer. |
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