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| Thermal Simulation and Calculation of Bridgewire Electro-explosive Device Electrode Plug under DC Excitation |
| Received:September 13, 2024 Revised:October 09, 2024 |
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| DOI：10.7643/issn.1672-9242.2024.11.001 |
| KeyWord:bridgewire electro-explosive device electrode plug lumped parameter method thermal simulation temperature rise thermal response parameter |
| Author | Institution |
| CHEN Hengshuai |
State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing , China |
| ZHU Dezhan |
State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing , China |
| ZHAO Fengqi |
State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing , China |
| QUAN Ting |
State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing , China |
| ZHU Yanli |
State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing , China |
| YAO Hongzhi |
State Key Laboratory of Transient Chemical Effects and Control, Shaanxi Applied Physics and Chemistry Research Institute, Xi'an , China |
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| Abstract: |
| The work aims to study the temperature rise characteristics of the bridgewire electro-explosive device electrode plug under DC excitation and calculate the temperature rise of the bridgewire based on the lumped parameter method. The COMSOL software was adopted to simulate and calculate the DC heating process of the electrode plug. The temperature rise and distribution of the electrode plug were obtained. The thermal response parameters of the bridgewire in the lumped parameter equation were obtained by fitting the simulated temperature rise. The temperature rise of the bridgewire under another excitation current was obtained by the formula and compared with the simulation result. Under 50 mA current, the temperature of the bridgewire showed a decreasing trend from the middle to both ends. The average temperature rise of the bridgewire was stable at 160 K after 10 ms. The temperature outside the bridgewire was much lower than that of the bridgewire and close to the ambient temperature. By fitting the simulated average temperature rise of the bridgewire, the heat capacity and heat loss factor of the bridgewire were determined to be 1.796 7×10–7 J/K and 9.296 0×10–5 W/K, respectively, resulting in a thermal time constant of 1.9328 ms. Under 70 mA current, the temperature rise of the bridgewire calculated by the formula was stable at 314 K and close to the simulated results. Under 50 mA current, the average temperature rise of the bridgewire in the actual solder joint model decreased by about 26 K compared to the simplified solder joint model. The thermal time constant was reduced by about 0.06 ms.The thermal response parameters of the bridgewire in the lumped parameter equation are fitted. The applicability of the lumped parameter method in calculating the average temperature rise of bridgewire is verified. Since the temperature of the pin wires is close to the ambient temperature, the thermal loss power of the bridgewire is basically proportional to the temperature rise of the bridgewire, which is consistent with the heat loss term in the lumped parameter equation.The actual solder joint model has an increase in heat capacity and heat loss factor due to the increase of bridgewire length. The increase rate of heat capacity is slightly greater than that of heat loss factor. |
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