Design and Verification of Plate-heat Transfer Oil Heat Sink for Space Environment Simulation Equipment
Received:November 25, 2024  Revised:December 24, 2024
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DOI:10.7643/issn.1672-9242.2025.03.006
KeyWord:environment simulation device  plate heat sink  thermal conductive silicone oil  temperature uniformity  pressure loss  finite element simulation
                       
AuthorInstitution
FENG Dawei Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China
LIU Weicheng Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China;Lanzhou Institute of Physics, CAST, Lanzhou , China
LI Xiangyang Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China
MA Yuelan Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China;Lanzhou Institute of Physics, CAST, Lanzhou , China
CAO Bin Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China
FAN Zhijian Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China;Lanzhou Institute of Physics, CAST, Lanzhou , China
YAN Changlin Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China;Lanzhou Institute of Physics, CAST, Lanzhou , China
YAN Ge Huayu Branch, Lanzhou Vacuum Equipment Co., Ltd., Lanzhou , China;Lanzhou Institute of Physics, CAST, Lanzhou , China
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Abstract:
      The work aims to study the effects of inlet flow rate of heat transfer oil, thickness of heat sink interlayer and matrix spacing of plate solder joints on temperature uniformity and pressure loss of heat sink. Through theoretical calculation and CAE simulation software, a single factor simulation test was designed to analyze the temperature uniformity of the heat sink surface and the pressure loss of the inlet and outlet. The optimal parameters were confirmed according to the results of the single factor simulation test. In the process of seeking the surface temperature difference of a heat sink not more than 1.55 K and a pressure loss as small as possible, the parameter combination that could achieve the optimal performance of the heat sink was:the inlet flow rate of the heat transfer oil was 2 m/s, the thickness of the interlayer was 8 mm, and the spacing of the plate solder joint matrix was 60 mm. According to the simulation results, the physical heat sink was made and tested. The test showed that the surface temperature difference of the heat sink was 1.28 K, and its error with the simulation value was 4.13%. The pressure loss was 22 943.7 Pa, and its error with the simulation value was 4.05%. The error between the simulation results and the measured results is less than 5%, which indicates that the simulation model is reliable and can be used as a design basis of plate-heat transfer oil heat sink.
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